Shijia Photons is committed to building an IDM full-process manufacturing platform for active and passive wafer chips. It brings a number of chips and device products applied to backbone networks, access networks, data centers (CPOs), FTTR, TDLAS, laser radar and other fields to the OFC exhibition held in San Diego on March 7-9, 2023.
New products being showcased in this OFC:
Passive products:
AWG module 60ch ultra-bandwidth for backbone network.
AWG 4ch assemblies, parallel assemblies and MPO connector, which are applied to 200G,400G, and 800G optical transceivers.
1×5, 1×9 PLC unbalanced optical splitter for FTTR.
Active products:
DFB FP lasers (Chip, TO) for access networks.
DFB lasers such as CWDM LWDM MWDM DWDM for data centers.
low noise and high-power lasers for silicon light sources.
Sensor lasers for TDLAS,
Seed source exciters for lidar,
High power pulse lasers for laser ranging,
Narrow linewidth and high power FMCW lidar lasers and SOA.
External cavity narrow linewidth lasers and gain chips are used for coherent communication.
Shijia Photons’Semiconductor lasers cover 1260 nm~1700 nm full-band products.
At that time, Shijia’s senior technical experts and senior customer managers will provide on-site technical and product consulting services. See you at Booth No. 4917.