- Address：Shenzhen International Convention and Exhibition C
- Date：2023/9/6-2023/9/8
- Booth NO.： 11B28
Booth no.: 11th HALL 11B28
The 24th CIOE will be held in Shenzhen International Convention and Exhibition Center (Baoan Annex). Please check the invitation letter of the exhibition and scan the QR code to get the visitor card for free.
Shijia Photons will bring a variety of chips and device products used in backbone network, access network, data center (CPO), FTTR, TDLAS, laser radar and other fields to the exhibition.
Highlights of passive products: 400G/800G parallel optical components, MT-FA components, CWDM4/LAN4-AWG chips and components, array VOA devices and VMUX modules, AWG/AAWG chips and modules (including wide bandwidths and extended waves), FTTR Chips, devices and modules, TFF-WDM modules, etc.;
Highlights of active products: DFB\FP lasers (Chip, TO) for access networks, DFB lasers such as CWDM\LWDM\MWDM\DWDM for data centers, low-noise high-power lasers for silicon light sources, Sensing lasers for TDLAS, seed source lasers for Lidar, high power pulsed lasers for laser ranging, narrow linewidth high power lasers for FMCW Lidar and SOA, external cavity narrow linewidth lasers for coherent communication and gain chips, our semiconductor lasers could cover the full band of 1260nm~1700nm products.
Shijia’s senior technical experts with our best members will provide technical and product consulting services on the spot, welcome for visiting.
Let’s meet in Shenzhen during 6-8th September!
