Products

Optical communication TO

Features

  • AlGaInAs MQW (Multiple Quantum Well)
  • Integrated DFB/FP LD Chip
  • Edge-emitting laser
  • Hermetic TO-56 package with a nominal
  • 6.5 mm focal point ball lens cap
  • Uncooled operation
  • Low threshold current
  • Integrated InGaAs monitoring photodiode
  • -40?C to 85?C operating case temperature
  • Compliant with GR-468 reliability
  • RoHS compliant

 

Applications

  • Telecom
  • Fiber Channel
  • Ethernet, Access

The SHIJIA’s Laser Diode design is a ridge structure with multi-quantum well (MQW) active
layers and distributed-feedback (DFB) grating layer. This high performance
and high reliability laser is suitable for  data communication
applications.

DML DFB seriesWork conditionItemsSupport Temperature
EPON2.5G2.5G 1310nm FP LD TO56I-Temp
GPON2.5G2.5G 1310nm DFB LD TO56E-Temp
GPON2.5G2.5G 1490nm DFB LD TO56 for OLT B+\C+\C++I\E\C-Temp
10GPON2.5G2.5G 1270nm DFB LD TO56E-Temp
10GPON2.5G2.5G 1490nm DFB LD TO56 for FTTRE\C-Temp
10GPON10G10G 1270nm DFB LD TO56I\E-Temp
4G LTE10G10G 1310nm FP LD TO56I-Temp
4G LTE10GAnti-reflective 10G 1310nm DFB LD TO56I\E\C-Temp
4G LTE10GAnti-reflective 10G BIDI 1270\1330nm DFB LD TO56I\E\C-Temp
5G10G10G CWDM 1271~1571nm DFB LD TO56I\E\C-Temp
5G25G25G LWDM DFB LD TO60C-Temp
5G25G25G MWDM DFB LD TO60C-Temp
Datacom2.5G2.5G 1310nm FP LD TO56I\C-Temp
Datacom2.5G2.5G 1550nm FP LD TO56I\C-Temp
Datacom2.5G2.5G 1310nm DFB LD TO56I\E\C-Temp
Datacom2.5G2.5G 1550nm DFB LD TO56I\E\C-Temp
Datacom2.5G2.5G CWDM 1270~1610nm DFB LD TO56I\E\C-Temp
Datacom10G10G CWDM 1271~1331nm DFB LD TO38I\E\C-Temp
Datacom25G10G ultra-frequency 1310nm DFB LD TO56C-Temp

2.5G 1310nm FP TO drawing

2.5G 1490nm DFB TO drawing