Products
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Planar Lightwave Circuit, AWG platform
Possessing the design and manufacturing capability for producing over 50,000 6-inch wafer chips per month.
Having end-to-end processing capabilities from photolithography, etching, material growth to chip cutting and testing.
Product range includes a complete series of optical splitter wafer chips, a full range of AWG wafer chips, VOA wafer chips, etc.
6-inch Optical Platform Stepper Lithography Machine Critical Dimension: 0.6 micrometers
Maximum Etching Depth: Silicon Dioxide 30 micrometers, Silicon 300+ micrometers Etching Uniformity: ±2%
Maximum Growth Thickness: 10 micrometers Thickness Uniformity: ±2% Refractive Index Uniformity: ±0.0003
Maximum annealing temperature: 1300°C
Possesses high-precision linear and contour cutting capabilities.
Capability for grinding and polishing at various angles (0°/6°/8°/42°, etc.).
Ability to test various types of optical chips, including PLC, AWG, and VOA.
Processing capabilities for various channel configurations (single core/4 cores/12 cores, etc.).
Processing capabilities at various angles (0°/6°/8°/42°, etc.).
Capabilities for various Mode Field Diameter (MFD) conversions and polarization-maintaining (PM) processing.
Core pitch measurement instrument.
Fully automatic coupling machine. Processing capabilities for the entire range of CWDM/LWDM products. Monthly production capacity of 400,000 units.
Capability to package both thermal and non-thermal AWG modules. Channel counts covering 40/48/60/96 channels, etc. Wavelength spacing covering 50GHz, 75GHz, 100GHz, 150GHz, etc. Monthly production capacity of 5,000 units.
Fully automatic isolator mounting machine. Fully automatic flash tester. Processing capabilities for various X/Y cable MPO. Optical coating capability Monthly production capacity of 100,000 units.
Capability to package various types of Wavelength Division Multiplexing (WDM) devices and modules (CWDM, LWDM, FWDM, DWDM, etc.).
Customization capability for semi-active WDM modules.
Monthly production capacity of 150,000 channels.
Packaging capability for the entire series of 2~256 channels PLC optical splitters.
Packaging types include steel-sealed, miniature, box-type, plug-in, tray-type, rack-mounted, etc. (customization available).
Monthly production capacity of 500,000 units.
Capability for device design and packaging of Silicon Photonics (SOI) and Mach-Zehnder Interferometer (MZI) Variable Optical Attenuators (VOA).
Design and packaging capability for intelligent modules.
Monthly production capacity of 2,000 units.
