The 27th China International Optoelectronic Exposition (CIOE 2026) has been successfully wrapped up at the Shenzhen World Exhibition & Convention Center. During this three-day industry event, the booth of Shijia Photonics (11B25, Hall 11) welcomed a steady stream of global customers, industry peers and research partners. We engaged in face-to-face technical exchanges, discussed industry trends and explored cooperation opportunities, marking a successful conclusion to our exhibition participation.
Leveraging the advantages of the dual-chip IDM platforms for passive and active components along with innovative R&D capabilities, Shijia Photons showcased a portfolio of optical chips, components and solutions, and fully demonstrated its In-house R&D and mass-production capabilities including chip design, wafer fabrication and device package.
At the booth, our technical team held in-depth discussions with visitors regarding product specifications, customization requirements, and challenges in project implementation. Also we exchanged insights with visiting experts on trending topics such as AI computing networks, high-speed interconnection, and coherent transmission.
The three‑day gathering has drawn to a close. Every stop and conversation represents trust and recognition. We sincerely thank all customers, partners and industry peers who visited our booth, as well as every team member for their full dedication.
The conclusion of the exhibition is not an end, but a brand‑new starting point for deepening cooperation. Facing the new era of AI‑driven optical communications, Shijia Photonics will keep focusing on independent innovation of optical chips. We will refine high‑performance, highly‑reliable and mass‑producible chips and devices. Supported by our dual‑IDM platforms, we will foster collaborative innovation across the upstream and downstream industrial chains, empower the construction of high‑speed computing networks, and deliver complete and reliable optical interconnection solutions for global customers.
The exhibition may close, but our communication continues. Should you require further information on exhibited products, sample support or technical consultation, please feel free to contact us via our official channels. We look forward to meeting you again at the next industry event. Let us chase light together and innovate for an intelligent future!